Advantages - Delta Precision Circuit Inc.

                       

" Panel Plating v Pattern Plating"

                       

Flat copper plating surfaces on PCB's manufactured at our facility are due to the Panel Plate process instead of Pattern Plate. Panel plate process provides equal current distribution over the entire panel plate surface. This provides even plating thickness over the entire surface and holes. Pattern plating current distribution depends on the design of the board. Copper thickness varies based on the density of the circuit to be plated. This causes high plating thickness in isolated areas (lower sq. ft.) and low thickness in the denser (higher sq. ft.) areas of the board. The variation in surface flatness accounts for uneven distribution of solder paste application during the board assembly. Acid etching also provides less undercut, positive foot for fine line PCB manufacturing. This helps to control etch line width for impedance controlled PCB manufacturing. Pattern plated PCB's requires Alkaline Etching process which provides more undercut and negative foot.

                       

" Figure 1: Panel Plate Before"

                                               

                       

" Figure 2: Panel Plate After Etching/Stripping"

                                               

                       

" Figure 3: Pattern Plate Before

                                               

Other Advantages:

• Mass Production Quality, Prototype Flex Circuits
• Fine Line Trace and Space Capability
• 0.0015” / 0.002” on 12 um Cu
• 0.002” / 0.003” on 0.5 oz Cu
• Minimal Adhesive Squeeze-out
• Tight and Consistent Trace to Edge
• Registration With Burr-free Edges
• Entek106A for Flip Chip Assembly
• Controlled Impedance Circuits