MATERIAL TYPES:
- FR4 Standard Multifunctional 135°C
- FR4 High Tg 150° - 210°C and high Td > 300°C
- Polyimide
- Neltek 4000-13
- Teflon
- Rogers RO4000 Series
- Rogers RO3000 Series
- Rogers RT/duroid 5870 & 5880
- Rogers RT/duroid 6006 & 6010LM
- Rogers TMM
- Aluminum Core – Bergquist, Thermagon, Ventec
INNER & OUTERLAYER MATERIALS
- Inner Layers:
- Maximum cu weight planes: 6 oz
- Maximum cu weight signals: 6 oz
- Minimum cu weight: 0.5 oz
- Outer Layers:
- Maximum cu weight: 11 oz
- Minimum cu weight: 0.5 oz
BONDING SHEET (PREPREG)
- FR4: Tg 135°- 210° C
- FR4 with Td > 300° C
- Polyimide
- Teflon
- Various Other High Frequency material
- Thermally Conductive dielectrics
ETCHING
- Minimum Outer Line Width: .004"
- Minimum Inner Line Width: .004"
- Minimum Outer Space, Trace/Trace: .004"
- Minimum Inner Space, Trace/Trace: .004
- Minimum Outer Space, Trace/Pad: .004"
- Minimum Inner Space, Trace/Pad: .004"
LAYER CONSTRUCTION
- Minimum core thickness: .004"
- Minimum dielectric: .0015"
- Buried and blind vias
- Silver filled vias / Dupont CB-100
- Sequential lamination construction
LAMINATION
- Maximum number of layers: 12
- Maximum board thickness: .250"
- Layer-to-Layer Registration +/-.005"
- Panel Thickness Tolerances
- .015" - .030" +/- .003"
- .031" - .080" +/- .005"
- .081" - .125" +/- .008"
- .125" +/- 10%
DRILLING
- Minimum drilled hole size: .010"
- Maximum drilled hole size: .265"
- Minimum slot width size: .020"
- Dimensions - Hole Location: +/- .003"
PLATING
- Maximum Hole Aspect Ratio: 10:1
- Tolerance - Plated Hole Size +/- .003"
PLATING FINISHES
- HASL
- Lead Free HASL
- Electrolytic Gold over Nickel
- Electroless Gold over Nickel
- Electrolytic Wire bondable Gold
- Electrolytic Soft Gold
- Immersion Tin
- Immersion Silver
- Organic Coating (OSP)
SOLDERMASK / LEGEND
- SMT Minimum Pad (edge to edge) with Rib (web) .010"
- Minimum covered copper feature to clearance .003"
- Minimum Soldermask Rib (web) .004"
- Minimum Clearance over pad: pad +.006"
- Minimum clearance pad edge to clearance edge:
- LPI - .002" & Wet Mask - .006"
- Soldermask colors: Red, Green, Blue, Black, Clear
- Legend colors: White, Yellow, Black, Red, Orange
- Silver filled vias / Dupont CB-100
- Via fill: Taiyo PSE 4000 BN
- Hysol IC, Macu via fill, Epic, Coates
- Via plug & via cap: Hysol SR1000
- LED White Legend
FABRICATION
- Tolerance on overall dimensions: +/- .005"
- Minimum inside radius: .015"
- Minimum Space, PCB Edge to Conductor .015"
- Scoring, Skip Scoring, Beveling
- Countersinking, Counter-boring, Controlled Depth Milling
ELECTRICAL TEST
- CAD net-list testing D356A
- Probe testing down to .004"
- Standard test parameters: isolation- 10 meg ohms,
- continuity- 20 ohms, test to IPC class 1, 2, 3
QUALITY SYSTEMS
- Minority Owned Corporation
- Applied for mil spec 55110
- UL Certified 94V0
- ISO-9001:2008 Certified
- IPC-A-600 Class I, II & III trained personnel
- Unless otherwise specified, all boards will meet requirements of IPC-A-600F CLASS
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